|
|
 |
| Title: Package Design Engineer, MTS |
| Location: Malaysia-Penang |
Responsibilities:
As a Package Design Engineer, MTS, you will:
- Advanced packaging substrate design from scratch to final release including CAD documentation
- Working with suppliers and subcontractors to ensure quality design and on time release
- Interfacing with internal product development engineering team to define package design solution
- Design rule and guidelines considering performance, cost and reliability
Qualifications include:
- BS/BA or equivalent
- 5 years of hands-on experience in high density IC packaging design field
- Comprehension of circuitry signal integrity and impact to package design consideration including pin assignment, design rule, layer count optimization for cost, via placement, etc.
- Detail oriented
- Excellent communication and project management skills
|
|
For more information or to submit a resume, contact PNHR@altera.com.
Apply through Altera Talent Management (ATM) System.
|
Related Links
|
|
|
|
Literature
> 
